Latest about Memory
South Korean memory giant SK Hynix has partnered with Taiwanese chip maker TSMC to produce next-gen HBM4 memory.
Samsung's CXL Memory Module Box, also known as CMM-B, can hold up to 2TB of CMM-D memory.
Samsung announced Snowbolt, its future HBM4 chip, at MemCom, along with its plans to increase its HBM production.
SK Hynix is to build a $90 billion chip production facility that will take 20 years to complete.
SK Hynix is reportedly in talks with Kioxia to manufacture HBM chips at its facilities in Japan
SK Hynix has already sold out of this year's "planned production volume" of HBM.
ULTRARAM is fast, non-volatile memory that could one day replace RAM and NAND.
Samsung's new DDR5 memory offers double the capacity of 16Gb DDR5 DRAM in the same package size.
