Latest about Memory
Samsung's CXL Memory Module Box, also known as CMM-B, can hold up to 2TB of CMM-D memory
Samsung's CXL Memory Module Box, also known as CMM-B, can hold up to 2TB of CMM-D memory.
Samsung announced Snowbolt, its future HBM4 chip, at MemCom, along with its plans to increase its HBM production
Samsung announced Snowbolt, its future HBM4 chip, at MemCom, along with its plans to increase its HBM production.
SK Hynix is to build a $90 billion chip production facility that will take 20 years to complete
SK Hynix is to build a $90 billion chip production facility that will take 20 years to complete.
SK Hynix is reportedly in talks with Kioxia to manufacture HBM chips at its facilities in Japan.
SK Hynix is reportedly in talks with Kioxia to manufacture HBM chips at its facilities in Japan
SK Hynix has already sold out of this year's "planned production volume" of HBM
SK Hynix has already sold out of this year's "planned production volume" of HBM.
ULTRARAM is fast, non-volatile memory that could one day replace RAM and NAND
ULTRARAM is fast, non-volatile memory that could one day replace RAM and NAND.
Samsung to reveal superfast DDR5 memory chip
Samsung's new DDR5 memory offers double the capacity of 16Gb DDR5 DRAM in the same package size.
Samsung's 280-layer QLC NAND flash memory chip could lead to larger SSDs.
Samsung's 280-layer QLC NAND flash memory chip could lead to larger SSDs.
