Memory

Micron's 36GB HBM3E 12-high memory offers 50% more capacity, 1.2TB/s bandwidth, and 30% lower power than competitors, fueling AI innovation.

Bargains could be around in very short order for DDR4 RAM sticks (faster DDR5 modules, though, are another matter).

Samsung starts mass production of 1Tb QLC NAND chips that target enterprise servers

Samsung set to mass-produce 256GB CXL-enabled DRAM by the end of the year to boost AI.

32 and 64GB LPCAMM2 memory modules go on sale, but the new laptop RAM is shockingly expensive right now.

IGZO DRAM, being developed by the likes of imec and Samsung, could supercharge AI and lower power consumption.

South Korean memory giant SK Hynix has partnered with Taiwanese chip maker TSMC to produce next-gen HBM4 memory.

Samsung's CXL Memory Module Box, also known as CMM-B, can hold up to 2TB of CMM-D memory.

Samsung announced Snowbolt, its future HBM4 chip, at MemCom, along with its plans to increase its HBM production.

SK Hynix is to build a $90 billion chip production facility that will take 20 years to complete.