A new way of building electronic circuitry that pours a liquid epoxy resin over components promises future gadgets that are likely to be both thinner and better fitted-out than ever before.
The silver epoxy compound is the brainchild of a company called Vertical Circuits and it aims to use the method to pack more flash memory into a smaller space.
Money at stake
Company board member and former Seagate CEO Bill Watkins explains: "The thing that has stunned me is how much a Dell or Apple will pay for thinness. There's a big difference for them between 2mm and 1mm on some of this stuff."
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The Vertical Circuits technique eliminates wiring used to connect chips by stacking them atop each other in what is known as a '3D' construction. It then drips the patented silver epoxy over the package, giving all parts fast, reliable electrical connections to each other and circuit boards.
The result is more memory in a smaller space and that can be used either to make gadgets thinner or to use the recovered territory to build in bigger screens, more powerful batteries or extra components.